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Publications in JSSC, SSC-L, ISSCC, A-SSCC, CICC, TCAS-I/II, TBioCAS, TIE, TSP, etc. Check Google Scholar»

2025

 

• A. Ghonem, A. Bermak and B. Wang, “Incremental Delta-Sigma ADC with Reduced Conversion Cycles via Quantization-Skip,” IEEE Int’l. Symp. Circ. Syst. (ISCAS), London, UK, May 2025. Accepted. Read PDF»


• N. Quadir, M. A. Awan, B. Wang and A. Bermak, “Current-Mirror Based Ambient Light Rejection Technique for VLC Receiver,” IEEE Int’l. Symp. Circ. Syst. (ISCAS), London, UK, May 2025. Accepted. Read PDF»


• B. Wang, A. Bermak and M.-K. Law, “A 16-bit Incremental ADC Enabled by An Efficient Shooting Integrator with Inherent Noise Reduction,” IEEE Custom Integrated Circuits Conf. (CICC), Boston, USA, April 2025. Accepted. Read PDF»

2024

 

• Y. J. Geng, H. C. Lin, B. Wang and C. Wang, “Cryo-CMOS Dual-Qubit Homodyne Reflectometer Array with Degenerate Parametric Amplification,” IEEE Journal of Solid-State Circuits (JSSC), vol. 59, no. 5, pp. 1486-1496, Oct. 2024. Read PDF»


• M. A. Awan, K. Ahmad, A. Bermak and B. Wang, “An Asynchronous CMOS Current Readout with 124 dB Dynamic Range for Bioluminescence Sensing,” IEEE Solid-State Circuits Letter (SSCL), vol. 40, no. 1, pp. 140-144, Oct. 2024. Read PDF»


• Z. U. Islam, A. Bermak and B. Wang, “A Review of Microstrip Patch Antenna-Based Passive Sensors,” Sensors, vol. 24, no. 19, pp. 6355, Sept. 2024. Read PDF»


• W. Xu, Z. J. Li, Z. T. Fang, B. Wang, et al., “A sub-5mW monolithic CMOS-MEMS thermal flow sensing SoC with ±6m/s linear range,” IEEE Journal of Solid-State Circuits (JSSC), vol. 59, no. 5, pp. 1486-1496, May 2024. Read PDF»


• M. Duan, Z. X. Peng, B. Wang, A. Khelif, Y.K. Lee, and A. Bermak, “A highly integrated Lab-on-a-CMOS platform for real-time monitoring of E. Coli growth kinetics,” IEEE Trans. Biomedical Circ. and Syst. (TBioCAS), vol. 18, no. 1, pp. 174-185, Feb. 2024. Read PDF»


• X. L. Chen, J. C. Wu, B. Wang and M.-K. Law, “A 0.9V CMOS Voltage Reference with 0.41% Untrimmed Accuracy and 44.7 ppm/°C TC from -35°C to 130°C,” IEEE Asian Solid-State Circ. Conf. (A-SSCC), Hiroshima, Japan, 2024. Read PDF»


• K. Hu, J. C. Wu, B. Wang and M.-K. Law, “A 33.6nW Capacitively Coupled Chopper Amplifier with Stacked Input-Boosted Gate-and-Bulk-Driven Inverter Achieving 0.59 NEF and 0.42 PEF in 180nm CMOS,” IEEE Asian Solid-State Circ. Conf. (A-SSCC), Hiroshima, Japan, 2024. Read PDF»


• M. A. Awan, S. Shurbaji, A. Bermak, K. H. Biswas and B. Wang, “A Low Noise Current Readout with 124 dB Dynamic Range for Bioluminescence Sensing,” IEEE Biomedical Circ. and Syst. Conf. (BioCAS), Xi’an, China, 2024. Read PDF»


• A. Bermak, T. Liu, Z. Zhao, B. Wang and M. Zhang, “20 Years of Biomedical Image Acquisition and Processing at BioCAS,” IEEE Biomedical Circ. and Syst. Conf. (BioCAS), Xi’an, China, 2024. Read PDF»

2023

 

• Y. Geng, H. Lin, B. Wang and C. Wang, “A Cryo-CMOS Parametric Frequency Divider With −189.1 dBm/Hz Output Noise Floor at 4.2 K for High-Fidelity All-Parametric Quantum Reflectometer,” IEEE Microwave and Wireless Technology Letters (MWTL), vol. 33, no. 12, pp. 1650-1653, Dec. 2023.Read PDF»


• B. Wang, M. K. Law, and J. Schneider, “L2min2/2s: efficient linear reconstruction filter for incremental delta-sigma ADCs,” IEEE Trans. Signal Processing (TSP), vol. 71, pp. 3229-3241, 2023. Read PDF» or Access in IEEE»


• K. E. Jeon, T. N. Lin, J. She, S. Wong, R. Govindan, T. Al-Ansari, and B. Wang, “LuXSensing beacon: batteryless IoT sensor, design methodology, and field test for sustainable greenhouse monitoring,” IEEE Trans. AgriFood Electronics (TAFE), vol. 1, no. 2, pp. 86-98, Dec. 2023. Read PDF»


• T. Yang, M. D. Li, Z. J. Wang, Y. Yang, L. Zhang, B. Wang, and F. Tang, “A 100-ppm integrated TDM-based single-phase wattmeter for smart grid,” IEEE Trans. Circ. Syst. II: Express Briefs (TCAS-II), vol. 70, no. 2, pp. 406-410, Feb. 2023. Read PDF»


• Y. Yi, M. Chiao, K. A. Mahmoud, and B. Wang, “An MXene-doped PVA/PVP hydrogel-based strain sensor applicable in liquid environment,” Smart Materials and Structures (SMS), vol. 32, no. 2, pp. 025010, Jan. 2023. Read PDF»


• Y. Geng, H. Lin, B. Wang and C. Wang, “A Cryo-CMOS 4.5~7GHz dual-qubit homodyne reflectometer array with high Q degenerate parametric amplifier through dynamic mode coupling,” IEEE Asian Solid-State Circuits Conf. (A-SSCC), pp. 1-2, Nov. 2023.Read PDF»


• N. Fares, B. Wang and S. Bakiras, “Design and implementation of certificateless cryptography for IoT applications,” IEEE Int’l. Midwest Symp. Circ. Syst. (MWSCAS), pp. 933-937, Aug. 2023. Read PDF»


• K. E. Jeon, J. She, and B. Wang, “Information-aware sensing framework for long-lasting IoT sensors in greenhouse,” IEEE Wireless Comm. and Networking Conf. (WCNC), pp. 1-6, March 2023. Read PDF»

2022

 

• B. Wang, and M. K. Law, “Subranging BJT-based CMOS temperature sensor with a ±0.45°C inaccuracy (3σ) from −50°C to 180°C and a resolution-FoM of 7.2 pJ·K² at 150°C,” IEEE Journal of Solid-State Circuits (JSSC), vol. 57, no. 12, pp. 3693-3703, Dec. 2022. Read PDF»


• M. A. Awan, M. Ahmed, and B. Wang, “A laser Doppler blood flow measurement system with a 151.4 dBΩ gain and 0.05% nonlinearity for PAD patients,” IEEE Sensor J., vol. 22, no. 14, pp. 14196-14204, July 2022. Read PDF»


• Y. Yi, M. Chiao, K. A. Mahmoud, L. Wu, and B. Wang, “Preparation and characterization of PVA/PVP conductive hydrogels formed by freeze–thaw processes as a promising material for sensor applications,” Journal of Materials Science (JMS), vol. 57, pp. 8029–8038, April 2022. Read PDF»


• M. A. Akbar, B. Wang, and A. Bermak, “Self-repairing carry-lookahead adder with hot-standby topology using fault-localization and partial reconfiguration,” IEEE Open Journal of Circuits and Systems (OJCAS), vol. 3, pp. 50-58, March 2022. Read PDF»


• Y. Yi, B. Wang, X. Liu, and C. Li, “Flexible piezoresistive strain sensor based on CNTs–polymer composites: a brief review,” Carbon Letters, Feb. 2022. Read PDF»


• T. N. Lin, B. Wang, and A. Bermak, “Analysis of output ripple shape and amplitude in chopper instrumentation amplifier,” IEEE Trans. Circ. Syst. II: Express Briefs (TCAS-II), vol. 69, no. 2, pp. 299-303, Feb. 2022. Read PDF»


• N. A. Quadir, M. Hamdi, M. A. Awan, B. Wang and A. Bermak, “Design and analysis of a dual-band bistatic backscatter circuit for passive RFID tags,” IEEE Int’l. Symp. Embedded Multicore/Many-core Systems-on-Chip (MCSoC), pp. 301-304, Dec. 2022. Read PDF»


• Z. J. Li, Z. T. Fang, B. Wang, M. Ahmed, X. F. Pan, S. T. Han, X. J. Zhao, and W. Xu, “System-level modeling and design of a temperature compensated CMOS MEMS thermal flow sensor,” IEEE Int’l. Symp. Circ. Syst. (ISCAS), May. 2022. Read PDF»


• B. Wang, M. K. Law, and A. Bermak, “A BJT-based CMOS temperature sensor achieving an inaccuracy of ±0.45^oC (3σ) from -50^oC to 180^oC and a resolution-FoM of 7.2pJ·K² at 150^oC,” IEEE Int’l. Solid-State Circ. Conf. (ISSCC), pp. 72-74, Feb. 2022. Read PDF»

2021

 

• S. Khan, S. Ali, A. Khan, B. Wang, T. Al-Ansari, and A. Bermak, “Substrate treatment evaluation and their impact on printing results for wearable electronics,” Frontiers in Electronics, Nov. 2021. Read PDF»


• T. N. Lin, B. Wang, and A. Bermak, “Ripple suppression in capacitive-gain chopper instrumentation amplifier using amplifier slicing,” IEEE Trans. Circ. and Syst. I: Regular Papers (TCAS-I), vol. 68, no. 10, pp. 3991-4000, Oct. 2021. Read PDF»


• Z. Z. Zeng, J. J. Lopez, B. Wang, and E. S. Sinencio, “A CMOS energy harvesting interface circuit with cycle-to-cycle frequency-to-amplitude conversion MPPT for centimeter-scale wind turbine,” IEEE Trans. Circ. and Syst. I: Regular Papers (TCAS-I), vol. 68, no. 9, pp. 3587-3597, Sept. 2021. Read PDF»


• K. Khan, S. Ali, A. Khan, B. Wang, and A. Bermak, “Inkjet printing of multi-stripes based deflection monitoring sensor on flexible substrate,” Sensors and Actuators A: Physical, June 2021. Read PDF»


• A. Khan, K. Rahman, S. Ali, S. Khan, B. Wang, and A. Bermak, “Fabrication of circuits by multi-nozzle electrohydrodynamic inkjet printing for soft wearable electronics,” Journal of Materials Research (JMR), vol. 36, pp. 3568–3578, April 2021. Read PDF»


• Y. Yi, C. Mu, and B. Wang, “An electrochemically actuated drug delivery device with in-situ dosage sensing,” Smart Materials and Structures (SMS), vol. 30, no. 5, pp. 1-9, March 2021. Read PDF»


• K. Khan, S. Ali, A. Khan, B. Wang, and A. Bermak, “Printing sensors on biocompatible substrates for selective detection of glucose,” IEEE Sensor J., vol. 21, no. 4, pp. 4167-4175, Feb. 2021. Read PDF»


• M. Akbar, B. Wang, and A. Bermak, “A high-speed parallel architecture for ripple carry adder with fault detection and localization,” Electronics, 1791, Jan. 2021. Read PDF»


• Y. Yi, A. Samara, and B. Wang, “A new approach for an ultra-thin piezoresistive sensor based on solidified carbon ink film,” Journal of Materials Science (JMS), 56, 607–614 (2021). Read PDF»


• B. Wang, S. W. Wang, and M. K. Law, “On low-Leakage CMOS switches,” IEEE Int’l. Midwest Symp. Circ. Syst. (MWSCAS), Aug. 2021. Read PDF»


• N. A. Quadir, M. A. Awan, A. Mohamed, and B. Wang, “An active inductor based TIA with ambient light rejection for VLC applications,” IEEE Int’l. Midwest Symp. Circ. Syst. (MWSCAS), Aug. 2021. Read PDF»


• M. A. Awan, B. Wang, N. A. Quadir, and A. Bermak, “Review and analysis of CMOS current readout circuits for biosensing applications,” IEEE Int’l. Symp. Circ. Syst. (ISCAS), May. 2021. Read PDF»


• J. H. Fernandez, B. Wang, A. Massoud, S. Talib, M. Shhaab, and A. Mohamed, “On ambient temperature of transformer substations in desert climates,” IEEE PES Innovative Smart Grid Technologies (ISGT), Feb. 2021. Read PDF»

2020

 

• M. Akbar, B. Wang, and A. Bermak, “Self-repairing hybrid adder with hot-standby topology using fault-localization,” IEEE Access, vol. 8, pp. 150051-150058, Aug. 2020. Read PDF»


• B. Wang, M.-K. Law, S. Brahim Belhaouari, and A. Bermak, “Near-optimal decoding of incremental delta-Sigma ADC output,” IEEE Trans. Circ. and Syst. I: Regular Papers (TCAS-I), vol. 67, no. 11, pp. 3670-3680, Nov. 2020. Read PDF»


• F. Tang et al., “A noise-reduced light-to-frequency converter for sub-0.1% perfusion index blood SpO₂ sensing,” IEEE Trans. Biomed. Circ. and Syst. (TBioCAS), vol. 14, no. 5, pp. 931-941, Oct. 2020. Read PDF»


• F. Tang et al., “A 32-Step phase-compensated spread-spectrum RF-PLL with 19.44-dB EMI reduction and 10-fs extra RMS jitter,” IEEE Trans. Microw. Theory Techn. (TMTT), vol. 68, no. 4, pp. 1564-1575, April 2020. Read PDF»


• B. Wang, M.-K. Law, S. Brahim Belhaouari, and A. Bermak, “Near-optimal decoding of incremental delta-sigma ADC output,” IEEE Int’l. Symp. on Integrated Circ. Syst. (ISICAS), Aug. 2020. Read PDF»


• B. Wang, M. K. Law, and A. Bermak, “On fully differential incremental ΔΣ ADC with initial feedback zeroing and 1.5-Bit feedback," IEEE Int’l. Symp. Circ. Syst. (ISCAS), May. 2020. Read PDF»


• Tobi Delbruck et. al., “Invited Paper: lessons learned the hard way," IEEE Int’l. Symp. Circ. Syst. (ISCAS), May. 2020. Read PDF»


• T. N. Lin, B. Wang, S. B. Belhaouari, and A. Bermak, “A chopper instrumentation amplifier with amplifier slicing technique for offset reduction," IEEE Int’l. Symp. Circ. Syst. (ISCAS), May. 2020. Read PDF»


• S. Khan, S. Ali, H. Mohsin, B. Wang, and A. Bermak, “Printing sensor on flexible substrates for detection of volatile organic compounds," IEEE Int’l. Symp. Circ. Syst. (ISCAS), May. 2020. Read PDF»


• Z. Z. Zeng, S. P. Shen, B. Wang, J. Johan, R. Murch, and E. Sánchez, “An ultra-low-power power management circuit with output bootstrapping and reverse leakage reduction function for RF energy harvesting," IEEE/MTT-S Int’l. Microwave Symp. (IMS), June 2020. Read PDF»

Before 2020

 

• B. Wang, M.-K. Law, J. Yi, C.-Y. Tsui, and A. Bermak, “A -12.3 dBm UHF passive RFID sense tag for grid thermal monitoring,” IEEE Trans. Ind. Electron. (TIE), vol. 66, no. 11, pp. 8811-8820, Nov. 2019. Read PDF»


• Y. Yi, B. Wang, and A. Bermak, “A low-cost strain gauge displacement sensor fabricated via shadow mask printing,” Sensors, 4713, Oct. 2019. Read PDF»


• C. Li, B. Wang, Huang, R., and Y. Yi, “A resonant coupling power transfer system using two driving coils,” Energies, 2914, July 2019. Read PDF»


• W. Xu, B. Wang, M. Z. Duan, M. Ahmed, A. Bermak, and Y. K. Lee, “A 3D integrated micro calorimetric flow sensor in CMOS MEMS technology,” IEEE Sensors Letters, vol. 3, no. 2, pp. 1-4, Feb. 2019. Read PDF»


• B. Wang, M.-K. Law, C.-Y. Tsui, and A. Bermak, “A 10.6 pJ·K² resolution FoM temperature sensor using astable multivibrator,” IEEE Trans. Circ. Syst. II: Express Briefs (TCAS-II), vol. 65, no. 7, pp. 869-873, July 2018. Read PDF»


• F. Tang, S. Li, B. Wang, A. Bermak, X. Zhou, and S. Hu, "A low power class-AB audio power amplifier with dynamic transconductance compensation in 55 nm CMOS process," IEEE Trans. Circ. and Syst. I: Regular Papers (TCAS-I), vol. 63, no. 9, pp. 1360-1369, Sept. 2016. Read PDF»


• F. Tang, B. Wang, and A. Bermak, “A column-parallel inverter-based cyclic ADC for CMOS image sensor with capacitance and clock scaling,” IEEE Trans. Electron Devices (TED), vol. 63, no.1, pp.162-167, Jan. 2016. Read PDF»


• B. Wang, M.-K. Law, A. Bermak, and F. Tang, “BJT process spread compensation utilizing base recombination current in standard CMOS,” IEEE Electron Device Lett. (EDL), vol.36, no.11, pp.1111-1113, Nov. 2015. Read PDF»


• B. Wang, M.-K. Law, and A. Bermak, “A precision CMOS voltage reference exploiting silicon bandgap narrowing effect,” IEEE Trans. Electron Devices (TED), vol.62, no.7, pp.2128 - 2135, Jul. 2015. Read PDF»


• B. Wang, M.-K. Law, A. Bermak, and H.-C. Luong, “A passive RFID tag embedded temperature sensor with improved process spreads immunity for a -30 ^oC to 60 ^oC sensing range,” IEEE Tran. Circ. Syst. I: Reg. Papers (TCAS-I), vol.61, no.2, pp. 337 - 346, Feb. 2014. Read PDF»


• F. Tang, D.-G. Chen, B. Wang, and A. Bermak, “CMOS on-chip stable true-random ID generation using antenna effect,” IEEE Electron Device Lett. (EDL), vol.35, no.1, pp. 54 - 56, Jan. 2014. Read PDF»


• F. Tang, D.-G. Chen, B. Wang, and A. Bermak, “Low-power CMOS image sensor based on column-parallel single-slope/SAR quantization scheme,” IEEE Trans. Electron Devices (TED), vol.60, no.8, pp. 2561 - 2566, Aug. 2013. Read PDF»


• B. Wang, J. H. Fernandez, and A. Massoud, “A wireless battery temperature monitoring system for electric vehicle charging," IEEE Sensors Conf., Montreal, Canada, Nov. 2019. Read PDF»


• Y. Yi, S. Ali, and B. Wang, “An inkjet-printed strain sensor with a carbon-silver-polyimide topology,” IEEE Int’l. Conf. on Flexible and Printable Sensors and Systems (FLEPS), Glasgow, UK, July. 2019. Read PDF»


• T. N. Lin, B. Wang, and A. Bermak, “Review and analysis of instrumentation amplifier for IoT applications,” IEEE Int’l. Midwest Symp. Circ. Syst. (MWSCAS), Windsor, Canada, Aug. 2018. Read PDF»


• T. T. Zhang, M.-K. Law, B. Wang, Pui-In Mak, Mang-I Vai, and R. P. Martins, “A 310 nW 14.2-bit iterative-incremental ADC for wearable sensing systems,” IEEE Int’l. Symp. Circ. Syst. (ISCAS), May 2017. Read PDF»


• D. P. Sun, M.-K. Law, B. Wang, Pui-In Mak, and R. P. Martins, “Piecewise BJT process spread compensation exploiting base recombination current,” IEEE Int’l. Symp. Circ. Syst. (ISCAS), May 2017. Read PDF»


• W. Xu, B. Gao, M. Ahmed, M. Duan, B. Wang, S. Mohamad, A. Bermak, and Y.-K. Lee, “A wafer-level encapsulated CMOS-MESM thermoresistive calorimetric flow sensor with integrated packaging design,” IEEE Int’l. Conf. Micro Electro Mechanical Syst. (MEMS), Jan. 2017. Read PDF»


• X. Lu, B. Wang, Z.-H. Wen, X.-J. Zhao, Y. Cao, and A. Bermak, "A low power relaxation oscillator with process insensitive auto-calibration scheme," IEEE Asia Pacific Conf. Circ. Syst. (APCCAS), Oct. 2016. Read PDF»


• B. Zhang, X.-P. Zhong, B. Wang, P. Sander, and A. Bermak, “Wide dynamic range PSD algorithms and their implementation for compressive imaging,” IEEE Int’l. Symp. Circ. Syst. (ISCAS), Montreal, QC, pp. 2727-2730, May 2016. Read PDF»


• B. Wang, M.-K. Law, S. Mohamad, and A. Bermak, “A 2.2uW 15b incremental delta-sigma A/D with output-driven input segmentation,” IEEE/ACM Asia and South Pacific Design Automation Conf. (ASP-DAC), University Design Contest, Jan. 2016 (Best Design Award) Read PDF»


• X.-P. Zhong, B. Wang, and A. Bermak, “A reconfigurable time-domain comparator for multi-sensing applications,” IEEE Int’l. Symp. Circ. Syst. (ISCAS), Lisbon, Portugal, pp. 349 – 352, May 2015. Read PDF»


• B. Wang, M.-K. Law, and A. Bermak, “A low-cost capacitive relative humidity sensor for food moisture monitoring application,” Asia Symp. Quality Electronic Design (ASQED), Penang, Malaysia, pp. 95 - 99, July 2012. Read PDF»


• F. Tang, B. Wang, and A. Bermak, “80 dB dynamic range 100 kHz bandwidth inverter-based ADC for CMOS image sensor,” IEEE Int’l. Symp. Circ. Syst. (ISCAS), Seoul, Korea, pp. 3094-3097, May 2012. Read PDF»


• B. Wang, M.-K. Law, and A. Bermak, “A sub-1V BJT-based CMOS temperature sensor from -55 ^oC to 125 ^oC,” IEEE Int’l. Symp. Circ. Syst. (ISCAS), Seoul, Korea, pp.3114-3117, May 2012. Read PDF»

 

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